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Microresistance — technique used
to measure copper in plated-thru-holes after etch as well as copper
on the surface of printed circuit boards.
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The new micro-resistance method of
determining plating thickness is ideally suited for printed circuit
board plated-thru-holes and for surface copper measurements.
This technique requires precise measurement of the resistance
of the copper cylinder that forms the plated thru-hole. Once this
parameter is known, it is combined with data on the board and
hole aspect ratio to calculate the average copper plating thickness.
Calculations are performed automatically by software associated
with the measurement device.
Specially designed, pyramidal, electrically isolated probe tips
simultaneously inject current and take voltage-drop measurements.
The resistance is then calculated by Ohm’s Law.
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